Solder Screening with Handheld XRF
RoHS
and similar legislation have mandated a switch to the
use of lead-free solder in many electronic assembly
processes. This dictates the need to verify the lead-free
nature of solder being used in the manufacturing arena. The
lead (Pb) in these solders must be less than 0.1 weight
percent (1000 mg/kg), and testing is generally recommended
to verify that the solder (paste, bars, and solder bath)
remain free of Pb contamination and below the 0.1% RoHS
tolerance limit.
While screening for Pb contamination, manufacturers can,
as an added benefit, also control the copper level of the Pb-free
solder bath, one of the more problematic contaminants at
this stage of the manufacturing process.
The features of Thermo Scientific NITON analyzers make them
the ideal tools for rapid, on-site verification of the lead
content in a variety soldering materials:
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Fast, reliable, nondestructive analysis of bars, wires,
and pastes – even solder baths
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Quantification of total Pb, Cd, Hg, and Cr within
seconds, providing timely Pass/Fail designations
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Portability and speed allow for
rapid testing wherever it may be
needed, allowing the user to
test solder at any stage of the
manufacturing process, from a
spool of solder to a tiny solder
joint on a populated PCB
-
Ease-of-use makes the instruments simple to integrate in a QC
procedure where all data is archived and downloadable
for reporting and recordkeeping
Product Literature